Breaking Boundaries: Chiplet Interconnects, SDVs & Electronica 2024 Embedded Insiders podcast

A tartalmat a Embedded Computing Design biztosítja. Az összes podcast-tartalmat, beleértve az epizódokat, grafikákat és podcast-leírásokat, közvetlenül a Embedded Computing Design vagy a podcast platform partnere tölti fel és biztosítja. Ha úgy gondolja, hogy valaki az Ön engedélye nélkül használja fel a szerzői joggal védett művét, kövesse az itt leírt folyamatot https://hu.player.fm/legal.

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Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024

10d ago 40:19

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On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.

Next, Rich is joined by Sayeed Ahmed, director at Infineon Technologies, to discuss the electrification of software-defined vehicles, according to Ahmed, there are still some tradeoffs and issues to be solved.

But first, Rich gives us a sneak peek into his trip to Munich for electronica 2024. Stay tuned to hear about the sessions and the top innovators of our Best-in-Show awards.

For more information, visit embeddedcomputing.com

260 epizódok

#Tech #Embedded Computing Designs #Science #Physics #Podcasting Education #Open Source